Embedded mechatronic systems. / Volume 2, Analysis of by Abdelkhalak El Hami, Philippe Pougnet

By Abdelkhalak El Hami, Philippe Pougnet

In operation, mechatronics embedded platforms are under pressure via a great deal of varied factors: weather (temperature, humidity), vibration, electric and electromagnetic. those stresses in elements result in failure mechanisms will be pointed out and modeled for higher regulate. AUDACE is a collaborative undertaking of the cluster Mov'eo that tackle matters particular to mechatronic reliability embedded structures. AUDACE capability interpreting the reasons of failure of elements of mechatronic platforms onboard. The objective of the venture is to optimize the layout of mechatronic units via reliability.

The venture brings jointly public quarter laboratories that experience services in research and modeling of failure, significant teams of mechatronics (Valeo and Thales) within the automobile and aerospace and small and medium organisations that experience talents in characterization and validation tests.

This publication might help you to:

  • Find and increase how one can signify and validate the layout robustness and reliability of advanced mechatronic devices
  • Develop how you can represent actual and chemical phenomena,
  • Identify mechanisms of failure of parts of those devices,
  • Analyze the actual and / or chemical mechanisms of failure, so as of importance
  • To version failure mechanisms and layout optimization.

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Extra info for Embedded mechatronic systems. / Volume 2, Analysis of failures, modeling, simulation and optimization

Sample text

During the static characterization phase, the probes of the pulsed system replace the control power supplies, the latter being dedicated to the aging stresses. However, these sensors must be close to the CUT. 3. 3. ). The copper soleplate is thermally controlled. It receives the CUT applied through interface circuits. The metal plate screwed to the heat sink provides mechanical support for the various elements of the media. The electronic control is embedded and hidden under the tray. 4. Schematic view of the test mount During the aging process, the CUT is supplied by two drain probes containing the highest values of capacitors connected to the interface circuit.

The defects caused by vibrations are the disconnection of the two conductors with electromagnetic compatibility (EMC) and the loosening of a screw holding the FR4. 58 Embedded Mechatronic Systems 2 The environmental conditions of the test are as follows: – temperature stages of 20 min; – temperature changes of ±60°C/min; – almost nitrogen-saturated approximately 10%. 1 A in the IGBTs; – electrical frequency of the current at a load of 100 Hz; – switching frequency of the IGBT of 10 kHz; – duty cycle change 35%–65%.

Realization of a dedicated bench for reliability and robustness studies of high LDMOS power transistors”, International Journal of Microwave and Optical Technology, vol. 9, no. 6, pp. 429–436, 2014. S. , “Analysis of the electrical characteristics of power LDMOSFETs having different design parameters under various temperature”, Microelectronics Journal, vol. 38, pp. 1027–1033, 2007. , DHERBECOURT P. , “Characterization and modeling of hot carrier injection in LDMOS for L-band radar application”, Microelectronics Reliability, vol.

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