RF and Microwave Microelectronics Packaging by Rick Sturdivant (auth.), Ken Kuang, Franklin Kim, Sean S.

By Rick Sturdivant (auth.), Ken Kuang, Franklin Kim, Sean S. Cahill (eds.)

RF and Microwave Microelectronics Packaging offers the newest advancements in packaging for high-frequency electronics. it's going to entice training engineers within the digital packaging and high-frequency electronics fields and to educational researchers attracted to figuring out top concerns within the advertisement quarter. It covers the newest advancements in thermal administration, electrical/RF/thermal-mechanical designs and simulations, packaging and processing tools in addition to different RF/MW packaging-related fields.

Bringing jointly years of expertise within the box, lead authors Ken Kuang, Franklin Kim and Sean Cahill have introduced jointly top engineers operating in electronics to discover the latest advancements of microelectronic packaging. RF and Microwave Microelectronics Packaging also:

  • Presents equipment and methods used for measuring and trying out of the digital fabrics properties.
  • Engages in an in-depth dialogue of ceramic fabrics for RF/MW packaging.
  • Offers numerical simulation equipment and methods utilized in research of digital units and materials.
  • Discusses thermal administration concerns for RF/MW packaging.
  • Creates a RF/Microwave Packaging Roadmap for transportable Devices.

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Extra info for RF and Microwave Microelectronics Packaging

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D) Font-side and back-side views of a polymeric substrate fabricated by means of self-aligned 3D hot embossing process using both front-side and back-side mold inserts. (e) Selective seed layer deposition in the front and back side. (f) A second polymer substrate is assembled by means of selective electroplating and bonding process 48 Y-K. Fuh et al. 4d–f. There are two key technology challenges which require careful investigation. First, the plastic-to-plastic bonding process in which the bonding strength and integrity is of great importance.

16 Model of a wire bond between substrates using HFSS (Ansoft Corporation [4]) The capacitors arise from bond pad capacitance and any capacitance of the wire bond to ground. Fig. 17 Wire bond equivalent circuit Flip chips offer an alternative to wire bonds for IC interconnects. They can provide very low inductance interconnects to 100 GHz. The connection between the integrated circuit and the motherboard is made using a bump. The bump can be solder or metallic using gold pads. One method of interconnection is to use metal bumps plated up on the IC with solder used to connect to the motherboard.

First, the mQFN package has little impact on insertion loss through the gain region, exhibiting performance approaching the bare die itself. This is especially noteworthy given the presence of connector, PCB, and transition losses. Second, the leading edge of the respective S21 graphs overlay one another perfectly. The trailing edge shows slightly early roll-off of the mQFN part. 4 nH of series inductance arising from the wirebond interconnects through the use of additional capacitance at the I/Os.

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